Power chips are linked to outside circuits through product packaging, and their efficiency depends on the assistance of the packaging. In high-power circumstances, power chips are typically packaged as power modules. Chip interconnection refers to the electric connection on the upper surface area of the chip, which is typically aluminum bonding cord in conventional modules. ^
Typical power module plan cross-section

Currently, commercial silicon carbide power modules still mainly use the product packaging technology of this wire-bonded standard silicon IGBT module. They deal with problems such as big high-frequency parasitic criteria, inadequate warm dissipation ability, low-temperature resistance, and not enough insulation stamina, which restrict the use of silicon carbide semiconductors. The display of superb efficiency. In order to fix these problems and totally manipulate the substantial possible benefits of silicon carbide chips, numerous brand-new packaging technologies and solutions for silicon carbide power modules have arised in recent times.

Silicon carbide power module bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have developed from gold wire bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually established from gold wires to copper cables, and the driving force is price reduction; high-power devices have actually established from aluminum cords (strips) to Cu Clips, and the driving pressure is to improve product performance. The better the power, the higher the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a strong copper bridge soldered to solder to link chips and pins. Compared to traditional bonding product packaging approaches, Cu Clip technology has the complying with benefits:

1. The connection in between the chip and the pins is constructed from copper sheets, which, to a specific degree, replaces the standard wire bonding approach between the chip and the pins. Therefore, an unique plan resistance value, greater existing circulation, and better thermal conductivity can be gotten.

2. The lead pin welding location does not require to be silver-plated, which can totally save the expense of silver plating and bad silver plating.

3. The product look is totally regular with regular items and is generally made use of in servers, portable computers, batteries/drives, graphics cards, motors, power materials, and other areas.

Cu Clip has two bonding methods.

All copper sheet bonding technique

Both the Gate pad and the Source pad are clip-based. This bonding method is a lot more costly and complicated, yet it can accomplish far better Rdson and better thermal results.

( copper strip)

Copper sheet plus wire bonding method

The resource pad uses a Clip method, and the Gate utilizes a Cable technique. This bonding method is a little more affordable than the all-copper bonding technique, conserving wafer location (relevant to very small gate locations). The process is simpler than the all-copper bonding method and can obtain far better Rdson and far better thermal impact.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper wire with alligator clips, please feel free to contact us and send an inquiry.

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